如何选购通孔返修台的机器呢?

2023-03-03

我们公司最近想采购一批通孔返修台,但不知道如何选购通孔返修台的机器呢?

通孔返修工作站 工业级返修设备

[editor] [] delete print reprint

标签: dip返修 通焊焊接 桌面焊接 小型波峰焊 插件焊接 分类: SMT资料

Tags: dip repair by welding welding soldering welding small desktop plug-in: SMT data classification

传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起,

Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together,

采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主,

The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components,

以通孔元件为辅,比如接插件,大容量电容,变压器等。为了避免对表面贴装元件的二次焊接(波峰焊),

The through-hole components such as connectors, auxiliary, large capacitance, transformer etc.. In order to avoid the two welding of surface mount components (wave),

可以采用针对局部的通孔器件选择性的进行小波峰焊接。这种选择性的焊接可以是自动选位置的选择性波峰焊,

Can be used for selective partial via device for small wave soldering. This selective welding can be selective soldering automatic position,

也可以是根据焊接的对象大小,设计成不同规格的喷锡口。将电路板放置在焊台上,针对需要焊接的通孔元件管腿,选择合适的喷锡口,启动波峰焊接。这种方法焊接的效率高,不伤及其他器件,与波峰焊相比节能。

Also can be according to the welding object size, designed to different specifications of the mouth spray tin. The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start. The efficiency of this method of welding, and other devices, such as compared with wave soldering.

从电路板上拆除多引脚的通孔元件和大热容量的通孔元件比较麻烦,比如变压器、接插件。对这种对象传统的方

Removed from the circuit board through-hole components via multi pin component and the large heat capacity is quite troublesome, such as transformer, connector. The object of the traditional party

法是采用手工的吸锡抢或金属吸锡线,但是效率低、容易损伤板子和器件。

Method is a manual suction grab or metal tin tin absorption line, but low efficiency, easy to damage the board and device.

采用喷流焊的方法拆除这些通孔元件可以避免这些问题。将电路板放置在焊台上,针对要解焊的通孔器件,

Using the method of jet welding dismantling these through-hole components to avoid these problems. The circuit board is placed in the welding stage, according to the device through hole welding solution,

选择合适的喷锡口,启动波峰,一次性同时融化所有的通孔引脚,从而安全方便地将器件从电路板上取下来

Select the appropriate tin spray mouth, start the crest, the through hole pin at the same time all to melt, safe and convenient device will take off from the circuit board

通孔返修站(返修插件) 通孔元件喷流焊和返修工作站 TOP-388 升级版  技术营销:13823298536 陈工

Through hole rework station (repair plug) through hole components of jet welding and repair work station TOP-388 upgraded version of technology marketing: 13823298536 Chen Gong





喷流DIP返修设备又称喷流锡炉或喷流式锡炉,它采用喷流锡液直接作用於焊点,主要适用於多引脚通孔器件的拆、焊。如:DIP(双列直插)IC ,PBGA,接插件,连接器插座等 

Jet DIP rework equipment also known as tin or tin jet jet, it adopts direct jet of molten tin in solder joint, mainly used for welding demolition, multi pin hole device. Such as: DIP (DIL) IC, PBGA, connector, connector socket etc.

数字温度设定,即时温度显示 

Digital temperature setting, real-time temperature display

高性能PID 温度控制器,精度±1℃ 

High performance PID temperature controller, the accuracy of plus or minus 1 DEG C

锡波可以TIMER设定喷流时间,PC板及零件不易受损 

Tin wave can TIMER jet set time, PC plate and the parts are not easy to be damaged

可以根据需要,设定喷流锡液的高度及流量 

May need to set height and flow tin liquid jet

配备安全回路,锡温未达设定温度,马达无法运转 

Equipped with safety circuit, tin Weida temperature setting temperature, the motor can operate

附中心定位灯,定位简单,操作容易 

Of center positioning lamp, simple positioning, easy operation

作业桌面为开放式,并附防静电桌垫,作业空间大,适合大型基板 

Operation desktop for open, with anti-static mat, large working space, suitable for large substrate

备多种选用喷咀可供选择,并接受特殊喷咀定制 

Used to produce a variety of nozzles are available, and accept the special custom nozzle

加热器加热迅速,最适用多层基板 

Heating rapidly, the application of multilayer substrate

又称喷流锡炉或喷流式锡炉,它采用喷流锡液直接作用於焊点,主要适用於多引脚通孔器件的拆、焊。如:DIP(双列直插)IC ,PBGA,接插件,连接器插座等 

Also known as tin or tin jet jet, it adopts direct jet of molten tin in solder joint, mainly used for welding demolition, multi pin hole device. Such as: DIP (DIL) IC, PBGA, connector, connector socket etc.



数字温度设定,即时温度显示 

Digital temperature setting, real-time temperature display

高性能PID 温度控制器,精度±1℃ 

High performance PID temperature controller, the accuracy of plus or minus 1 DEG C

锡波可以TIMER设定喷流时间,PC板及零件不易受损 

Tin wave can TIMER jet set time, PC plate and the parts are not easy to be damaged

可以根据需要,设定喷流锡液的高度及流量 

May need to set height and flow tin liquid jet

配备安全回路,锡温未达设定温度,马达无法运转 

Equipped with safety circuit, tin Weida temperature setting temperature, the motor can operate

附中心镭射灯,定位简单,操作容易 

Attached heart laser lamp, simple positioning, easy operation

作业桌面为开放式,并附防静电桌垫,作业空间大,适合大型基板 

Operation desktop for open, with anti-static mat, large working space, suitable for large substrate

备多种选用喷咀可供选择,并接受特殊喷咀定制 

Used to produce a variety of nozzles are available, and accept the special custom nozzle

加热器加热迅速,最适用多层基板

Heating rapidly, the application of multilayer substrate



主要功能配置:

The main function of configuration:

一.数字温度设定,即时温度显示;

A digital temperature setting, real-time temperature display;

二.高性能PID 温度控制器,精度±1℃ ;

Two. High performance PID temperature controller, the accuracy of plus or minus 1 DEG c;

三.锡波可以TIMER设定喷流时间,PC板及零件不易受损 ;

Three. Tin wave can TIMER set jet time, PC plate and the parts are not easy to be damaged;

四.可以根据需要,设定喷流锡液的高度及流量 ;

Four. According to the needs, set the height and the flow of molten tin jet;

配备安全回路,锡温未达设定温度,马达无法运转;五.附中心定位灯,定位简单,操作容易 ;

Equipped with safety circuit, tin Weida temperature setting temperature, the motor can operate; five. Attached center positioning lamp, simple positioning, easy operation;

六.作业桌面为开放式,并附防静电桌垫,作业空间大,适合大型基板 ;

Six. Work for desktop open, with anti-static mat, large working space, suitable for large substrate;

七. 备多种选用喷咀可供选择,并接受特殊喷咀定制 ;

Seven. Prepare a variety of choice of nozzle can be used to choose, and to accept the special nozzle custom;

八。加热器加热迅速,最适用多层基板 ;

Eight. Heater heats up quickly, the most suitable multilayer substrate;

九.锡槽&加热器材质为进口不锈钢。(抗腐蚀)

Nine. Tin Bath & heater material for imported stainless steel. (corrosion resistance)


选配多款喷咀

主要技术参数:

Main technical parameters:

1.电源:220V 50HZ ; 

1 power supply: 220V 50HZ;

2.焊锡重量:约15kg;

2 solder weight: about 15kg;

3.容锡高度:50MM;

3 Rong tin height: 50MM;

3.焊锡温度:0~450度,随意设置,智能温控保护;

3 solder temperature: 0 ~ 450 degrees, optional settings, intelligent temperature control protection;

4.机械尺寸:600(L)*400(W)*280(H),立式;

Mechanical dimensions: 4 (L) *400 (W) *280 () (H), vertical;

5.多喷口选配。

5 multi nozzle matching.

6.PCB尺寸:450*450MM

6.PCB size: 450*450MM

7.加热器功率: 1200W

7 heater power: 1200W

8.安全装置:马达超载保护

8 safety devices: motor overload protection

9.时间设定:1~60S

9 time setting: 1~60S

10.机器重量:40KG

10 machine weight: 40KG

参考知识1 这个主要是看你要返修的是什么器件了,如果是对返修工艺要求比较高的,建议你选择崴泰PTH通孔组件返修台的,他们这个返修台返修良率挺高的,目前很多大公司都在用的就是这个。如果对返修工艺要求不是很高的话那你可以选一些国内品牌都可以了的。 参考知识B 世迈腾公司研发S300通孔元件返修工作站是针对电路板上通孔元件的焊接及解焊而设计的。路板放置在焊台上,针对需要焊接的通孔元件管腿,技术水平很一般啊!
相似知识
如何调试BGA返修台的温度曲线? 参考知识11.目前smt常用的锡有两种即有铅和无铅成份为:铅Pb锡SN银AG铜CU。有铅锡珠Sn63Pb37融点183°,无铅锡珠Sn96.5Ag3Cu0.5融点217°2.调整温度时我们应该把测温线
BGA返修台的基本分类 参考知识1BGA返修台按温区分:1.三温区返修台            &nbs
BGA返修台的详细介绍 参考知识1BGA的全称是BallGridArray(球栅阵列结构的PCB),它是集成电路采用有机载板的一种封装法。它具有:①封装面积减少②功能加大,引脚数目增多③PCB板溶焊时能自我居中,易上锡④可靠
BGA返修台的相关释义 参考知识1分光学对位与非光学对位光学对位——通过光学模块采用裂棱镜成像,LED照明方式,调整光场分布,使小芯片成像显示与显示器上。以达到光学对位返修。非光学对位——则是通过肉眼将BGA根据PCB板丝印
回流焊炉与BGA返修台的区别是啥 回流焊炉只是加热工具提供回流的加热曲线。BGA返修台是集成加热固定夹持光学定位等全系类功能的,;一个是维修工具一个是组装工具。参考知识1简单SMT工艺流程:来料检测-->丝印焊膏(点贴片胶)--
请教,拆主板电容用热风焊台好还是电烙铁好。 哥们,我也是新手,焊电容通孔不通孔都一样反正就两个脚,非要通的话建议在吸锡器上套一段高压冒头上的胶皮管,既不怕烫又可以增强吸锡效果,很棒的,我开始也为通孔犯愁,现在轻松搞定。参考知识1用热风枪啊,用烙
BGA返修台是啥? BGA返修台,顾名思义,就是用来返修BGA的机器,BGA就是一种封装的芯片,比如电脑主板的南北桥就是封装的BGA,产线上面出现BGA生产不良,就需要用这机器来返修,看图片这应该是德正智能的一款光学对位
老公坚持买下带露台的房子,18天改成屋顶花园,前房主为啥说卖亏了? 很多人在选购房子的时候就会有个想法就是要购买楼顶的房子,这是因为什么呢?其实原因很简单,就是要选择一个带露台的房子,这样就能够给自己一个自行发挥的情况,然后能够极大地满足自己内心的一种虚荣心的,最近也